EP3CLS70F780I7N vs EP3CLS70F780C7 Vergleich
Detaillierter Direktvergleich von EP3CLS70F780I7N von Intel und EP3CLS70F780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ Aktiv
Spezifikationsvergleich
| Parameter | EP3CLS70F780I7N | EP3CLS70F780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $880,00 | $350,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory | 3,068,928 bits | — |
| Maximum User I/O | 413 pins | — |
| Versorgungsspannung | 1.2 V | — |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature] | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | unknown | Compliant |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Cyclone III LS |
| Embedded Memory Bits | — | 3,068,928 |
| User I/O Pins | — | 413 |
| Total I/O Pins | — | 780 (FBGA package) |
| Process Technology | — | 65 nm |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| Operating Frequency (max) | — | 437.5 MHz |
| Gehäuse | — | 780-ball FBGA |
| Speed Grade | — | C7 (commercial, low power) |
| Security Features | — | AES-256 bitstream encryption, JTAG protection, volatile key storage |
| Embedded Multipliers | — | 18 x 18 multipliers (DSP blocks) |
| PLLs | — | Yes (per PLL specification) |