EP3CLS70F780I7N vs EP3CLS70F780C7N Vergleich
Detaillierter Direktvergleich von EP3CLS70F780I7N von Intel und EP3CLS70F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ Aktiv
Spezifikationsvergleich
| Parameter | EP3CLS70F780I7N | EP3CLS70F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $880,00 | $318,75 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory | 3,068,928 bits | — |
| Maximum User I/O | 413 pins | 413 |
| Versorgungsspannung | 1.2 V | 1.2 V |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature] | 0C to +85C (commercial) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | unknown | Compliant |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Cyclone III LS |
| Logic Array Blocks | — | 47,452 |
| Total Memory Bits | — | 3,068,928 bits |
| Embedded Multipliers (18x18) | — | 200 |
| User I/O (this package) | — | 413 |
| Gehäuse | — | 780-ball FBGA (F780) |
| Pins/Balls | — | 780 |
| Core Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Transceivers | — | 0 (no high-speed transceivers) |