EP3CLS70F780I7N vs EP3CLS70F780C7N Comparación
Comparación detallada lado a lado de EP3CLS70F780I7N por Intel y EP3CLS70F780C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ Activo
Comparación de especificaciones
| Parámetro | EP3CLS70F780I7N | EP3CLS70F780C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $880,00 | $318,75 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory | 3,068,928 bits | — |
| Maximum User I/O | 413 pins | 413 |
| Tensión de alimentación | 1.2 V | 1.2 V |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature] | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | unknown | Compliant |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Cyclone III LS |
| Logic Array Blocks | — | 47,452 |
| Total Memory Bits | — | 3,068,928 bits |
| Embedded Multipliers (18x18) | — | 200 |
| User I/O (this package) | — | 413 |
| Encapsulado | — | 780-ball FBGA (F780) |
| Pins/Balls | — | 780 |
| Core Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Transceivers | — | 0 (no high-speed transceivers) |