EP3SE110F1152C3N vs EP3SE110F1152C4N Vergleich
Detaillierter Direktvergleich von EP3SE110F1152C3N von Intel und EP3SE110F1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N ⚠ Letzte BestellmöglichkeitIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE110F1152C3N | EP3SE110F1152C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.560,00 | $1.395,00 |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Series | Stratix III | — |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4300 |
| Total RAM Bits | 8,936,448 | — |
| User I/Os | 744 | — |
| Operating Frequency (max) | 500 MHz | — |
| Core Supply Voltage | 1.1 V nominal | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply range] | — |
| Process Technology | 65 nm TSMC | 65 nm |
| Package Type | FC-FBGA-1152 (flip-chip BGA) | — |
| Betriebstemperatur | 0 °C to 85 °C (commercial) | 0C to +85C (Commercial) |
| Speed Grade | C3 | — |
| Montageart | Surface Mount | Surface Mount |
| Montagestil | SMD/SMT (Tray) | — |
| DSP Blocks | Yes (embedded multipliers) | — |
| Speichertyp | M9K and M144K block RAM | — |
| External Memory Support | DDR/DDR2/DDR3 with read/write leveling | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | Yes (per Altera/Intel datasheet family convention) | — |
| Logic Elements | — | 107,500 |
| Memory Bits | — | 8,936,448 |
| Embedded Multipliers (18x18) | — | 896 |
| User I/O Pins | — | 744 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Gehäuse | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| RoHS-Status | — | Compliant |
| MSL-Level | — | 3 (168 hours) |
| Design Software | — | Quartus II (v9.1 or later) |