EP3SE110F1152C3N vs EP3SE110F1152C4N Comparación
Comparación detallada lado a lado de EP3SE110F1152C3N por Intel y EP3SE110F1152C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel
EP3SE110F1152C3N ⚠ Última compraIntel
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
EP3SE110F1152C4N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE110F1152C3N | EP3SE110F1152C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.560,00 | $1.395,00 |
| Family | Stratix III E | Stratix III Enhanced (E) |
| Series | Stratix III | — |
| Logic Elements (LE) | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 4300 |
| Total RAM Bits | 8,936,448 | — |
| User I/Os | 744 | — |
| Operating Frequency (max) | 500 MHz | — |
| Core Supply Voltage | 1.1 V nominal | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply range] | — |
| Process Technology | 65 nm TSMC | 65 nm |
| Package Type | FC-FBGA-1152 (flip-chip BGA) | — |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial) | 0C to +85C (Commercial) |
| Speed Grade | C3 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estilo de montaje | SMD/SMT (Tray) | — |
| DSP Blocks | Yes (embedded multipliers) | — |
| Tipo de memoria | M9K and M144K block RAM | — |
| External Memory Support | DDR/DDR2/DDR3 with read/write leveling | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | Yes (per Altera/Intel datasheet family convention) | — |
| Logic Elements | — | 107,500 |
| Memory Bits | — | 8,936,448 |
| Embedded Multipliers (18x18) | — | 896 |
| User I/O Pins | — | 744 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Encapsulado | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG / AES-256 |
| Estado RoHS | — | Compliant |
| Nivel MSL | — | 3 (168 hours) |
| Design Software | — | Quartus II (v9.1 or later) |