EP3SE110F1152C3N vs EP3SE110F1152I4L Vergleich

Detaillierter Direktvergleich von EP3SE110F1152C3N von Intel und EP3SE110F1152I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE110F1152C3N EP3SE110F1152I4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.560,00 $4.317,90
Family Stratix III E —
Series Stratix III Stratix III E
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4,300 —
Total RAM Bits 8,936,448 —
User I/Os 744 —
Operating Frequency (max) 500 MHz —
Core Supply Voltage 1.1 V nominal —
I/O Supply Voltage [DATA_NEEDED: I/O supply range] —
Process Technology 65 nm TSMC 40 nm
Package Type FC-FBGA-1152 (flip-chip BGA) —
Betriebstemperatur 0 °C to 85 °C (commercial) -40C to +100C (Industrial)
Speed Grade C3 I4 (fastest industrial grade)
Montageart Surface Mount Surface Mount
Montagestil SMD/SMT (Tray) —
DSP Blocks Yes (embedded multipliers) —
Speichertyp M9K and M144K block RAM —
External Memory Support DDR/DDR2/DDR3 with read/write leveling —
Boundary Scan IEEE 1149.1 (JTAG) —
RoHS [DATA_NEEDED: RoHS status] —
Lead-Free Yes (per Altera/Intel datasheet family convention) —
Logic Elements — 107,500
Embedded Memory Bits — 8,936,448 bits
User I/O Count — 744
Number of LABs/CLBs — 4300
DSP Multipliers — 528 (9-bit equivalent)
Gehäuse — 1152-BBGA, FCBGA
Supply Voltage (Core) — [DATA_NEEDED: nominal core voltage]
MSL-Level — 3 (168 Hours)
Packaging — Tray
RoHS-Status — [DATA_NEEDED: RoHS compliance status]

Datenblätter & Ressourcen

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