EP3SE110F1152C4 vs EP3SE260F1152C2 Vergleich

Detaillierter Direktvergleich von EP3SE110F1152C4 von Intel und EP3SE260F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE110F1152C4 EP3SE260F1152C2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.200,00 $2.400,00
Family Stratix III E —
Logic Elements 107,500 —
Embedded Memory 8,936,448 bits —
Maximum User I/Os 744 —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] 10,200
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V —
Maximum Performance 450 MHz —
Package Type 1152-ball FCBGA (Flip-Chip BGA) —
Operating Temperature Grade Commercial (C4) —
Configuration Memory SRAM-based (volatile) —
On-chip Termination Dynamic, programmable —
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL —
RoHS-Status Compliant Compliant
Manufacturer — Intel (formerly Altera)
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
User I/Os — 744
User I/O Banks — [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) — 1.1 V
Gehäuse — 1152-ball FC-FBGA (Flip Chip)
Montageart — Surface Mount
Speed Grade — C2 (commercial)
Betriebstemperatur — Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits]
Lead-Free — Yes
MSL-Level — [DATA_NEEDED: MSL rating]
Design Software — Quartus II (Stratix III support)

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