EP3SE110F1152C4 vs EP3SE260F1152C2 对比

详细并排对比 EP3SE110F1152C4 出自 Intel 和 EP3SE260F1152C2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ 最后一次采购

规格对比

参数 EP3SE110F1152C4 EP3SE260F1152C2
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 Obsolete
库存状态 有库存 有库存
单价(USD) $2,200.00 $2,400.00
Family Stratix III E —
Logic Elements 107,500 —
Embedded Memory 8,936,448 bits —
Maximum User I/Os 744 —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] 10,200
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V —
Maximum Performance 450 MHz —
Package Type 1152-ball FCBGA (Flip-Chip BGA) —
Operating Temperature Grade Commercial (C4) —
Configuration Memory SRAM-based (volatile) —
On-chip Termination Dynamic, programmable —
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL —
RoHS 状态 Compliant Compliant
Manufacturer — Intel (formerly Altera)
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
User I/Os — 744
User I/O Banks — [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) — 1.1 V
封装 — 1152-ball FC-FBGA (Flip Chip)
安装类型 — Surface Mount
Speed Grade — C2 (commercial)
工作温度 — Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits]
Lead-Free — Yes
MSL 等级 — [DATA_NEEDED: MSL rating]
Design Software — Quartus II (Stratix III support)

数据手册与资源

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