EP3SE110F780I3 vs EP3SE110F780I4L Vergleich
Detaillierter Direktvergleich von EP3SE110F780I3 von Intel und EP3SE110F780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE110F780I3 | EP3SE110F780I4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.395,00 | $1.395,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107500 | 107,500 |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements/Cells | 107500 | — |
| Total RAM Bits | 8936448 | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 1.1 V core | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Montageart | Surface Mount | Surface Mount (FC-FBGA) |
| Betriebstemperatur | -40C to +100C (industrial) | — |
| Gehäuse / Bauform | 780-BBGA, FCBGA (FineLine BGA) | — |
| Supplier Device Package | 780-FBGA | — |
| RoHS-Status | unknown | Compliant (per legacy Altera data) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | unknown | — |
| Grade | Industrial | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Core Voltage | — | 0.9 V |
| Gehäuse | — | 780-pin FC-FBGA (Flip-Chip BGA) |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |