EP3SE260F1152C2 vs EP3SE110F1152C4 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2 von Intel und EP3SE110F1152C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE260F1152C2 EP3SE110F1152C4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.400,00 $2.200,00
Manufacturer Intel (formerly Altera) —
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 [DATA_NEEDED: LAB count]
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Gehäuse 1152-ball FC-FBGA (Flip Chip) —
Montageart Surface Mount —
Speed Grade C2 (commercial) —
Betriebstemperatur Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] —
RoHS-Status Compliant Compliant
Lead-Free Yes —
MSL-Level [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Logic Elements — 107,500
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

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