EP3SE260F1152C2 vs EP3SE110F1152C4 对比

详细并排对比 EP3SE260F1152C2 出自 Intel 和 EP3SE110F1152C4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ 最后一次采购

规格对比

参数 EP3SE260F1152C2 EP3SE110F1152C4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $2,400.00 $2,200.00
Manufacturer Intel (formerly Altera) —
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 [DATA_NEEDED: LAB count]
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
封装 1152-ball FC-FBGA (Flip Chip) —
安装类型 Surface Mount —
Speed Grade C2 (commercial) —
工作温度 Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
MSL 等级 [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Logic Elements — 107,500
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

数据手册与资源

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