EP3SE260F1152C2N vs EP3SE260F1152C2 Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2N von Intel und EP3SE260F1152C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C2N EP3SE260F1152C2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $11.000,00 $2.400,00
Series Stratix III E Stratix® III E
Family FPGA - Field Programmable Gate Array —
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: operating temperature grade] Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits]
Gehäuse / Bauform 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm CMOS
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS-Status Compliant Compliant
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Manufacturer — Intel (formerly Altera)
Logic Elements (LE) — 255,000
Logic Array Blocks (LABs) — 10,200
Embedded Memory (bits) — 16,672,768
User I/Os — 744
User I/O Banks — [DATA_NEEDED: I/O bank count]
Core Voltage (VCCINT) — 1.1 V
Gehäuse — 1152-ball FC-FBGA (Flip Chip)
Speed Grade — C2 (commercial)
Lead-Free — Yes
Design Software — Quartus II (Stratix III support)

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