EP3SE260F1152C2N vs EP3SE260F1152C3N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C2N von Intel und EP3SE260F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C2N EP3SE260F1152C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $11.000,00 $7.500,00
Series Stratix III E Stratix III E
Family FPGA - Field Programmable Gate Array —
Number of Logic Elements 255000 —
Number of LABs/CLBs 10200 —
Total Memory Bits 16672768 —
Number of I/O 744 —
Voltage - Supply 1.1 V —
Montageart Surface Mount Surface Mount
Betriebstemperatur [DATA_NEEDED: operating temperature grade] 0 C to +85 C (Commercial)
Gehäuse / Bauform 1152-BBGA, FCBGA —
Process Technology 65 nm 65 nm
Maximum Frequency 600 MHz —
Supplier Device Package 1152-FCBGA —
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant Compliant
Lead Free Yes (per EP3SE260F1152C2G comparison) —
ECCN [DATA_NEEDED: ECCN code] —
Moisture Sensitivity [DATA_NEEDED: MSL level] —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
Gehäuse — 1152-BBGA, FCBGA
Core Voltage — 1.1 V
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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