EP3SE260F1152C3N vs EP3SE260F1152C2N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C3N von Intel und EP3SE260F1152C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C3N EP3SE260F1152C2N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $7.500,00 $11.000,00
Series Stratix III E Stratix III E
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 —
Gehäuse 1152-BBGA, FCBGA —
Montageart Surface Mount Surface Mount
Process Technology 65 nm 65 nm
Core Voltage 1.1 V —
Betriebstemperatur 0 C to +85 C (Commercial) [DATA_NEEDED: operating temperature grade]
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
RoHS-Status Compliant Compliant
Family — FPGA - Field Programmable Gate Array
Number of Logic Elements — 255000
Number of LABs/CLBs — 10200
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Gehäuse / Bauform — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
MSL-Level — [DATA_NEEDED: MSL rating]
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

Datenblätter & Ressourcen

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