EP3SE260F1152C4 vs EP3SE260F1152C2G Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C4 von Intel und EP3SE260F1152C2G von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C4 EP3SE260F1152C2G
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $8.900,00 $2.050,00
Series Stratix III E (Enhanced) EP3SE260
Family Stratix III Stratix III E
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) —
Core Voltage 1.1 V 1.1 V
Speed Grade C4 (slowest commercial grade) C2 (commercial)
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Gehäuse 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) 1152-BBGA, FCBGA (FineLine BGA)
Package Code BGA, square BGA (Ball Grid Array)
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
RoHS-Status Compliant (per distributor listings) Compliant (G suffix)
Betriebstemperatur Commercial (0C to +85C) - inferred from speed grade C4 —
Montageart Surface Mount (BGA) Surface Mount
Logic Elements / Cells — 255000
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Shape — Square
Technology / Process Node — 65 nm
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray

Datenblätter & Ressourcen

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