EP3SE260F1152C4 vs EP3SE260F1152C2N Vergleich

Detaillierter Direktvergleich von EP3SE260F1152C4 von Intel und EP3SE260F1152C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260F1152C4 EP3SE260F1152C2N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $8.900,00 $11.000,00
Series Stratix III E (Enhanced) Stratix III E
Family Stratix III FPGA - Field Programmable Gate Array
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 —
Embedded Memory Bits 16,672,768 —
User I/O Count 744 —
Process Technology 65 nm CMOS (TSMC) 65 nm
Core Voltage 1.1 V —
Speed Grade C4 (slowest commercial grade) —
Maximum Internal Frequency ~450 MHz (per FPGAkey listing) —
Gehäuse 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) —
Package Code BGA, square —
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Configuration Modes Passive Serial, Fast Passive Parallel, JTAG —
DSP Blocks (18x18 Multipliers) 384 —
PLL Count [DATA_NEEDED: PLL count] —
Transceivers External PHY interface only (no integrated GXB) —
RoHS-Status Compliant (per distributor listings) Compliant
Betriebstemperatur Commercial (0C to +85C) - inferred from speed grade C4 [DATA_NEEDED: operating temperature grade]
Montageart Surface Mount (BGA) Surface Mount
Number of Logic Elements — 255000
Number of LABs/CLBs — 10200
Total Memory Bits — 16672768
Number of I/O — 744
Voltage - Supply — 1.1 V
Gehäuse / Bauform — 1152-BBGA, FCBGA
Maximum Frequency — 600 MHz
Supplier Device Package — 1152-FCBGA
MSL-Level — [DATA_NEEDED: MSL rating]
Lead Free — Yes (per EP3SE260F1152C2G comparison)
ECCN — [DATA_NEEDED: ECCN code]
Moisture Sensitivity — [DATA_NEEDED: MSL level]

Datenblätter & Ressourcen

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