EP3SE260F1152I3 vs EP3SE260F1152C2N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152I3 von Intel und EP3SE260F1152C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1152I3 | EP3SE260F1152C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16.500,00 | $11.000,00 |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | 10200 |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature grade] |
| Process Technology | 65 nm | 65 nm |
| Maximum Fabric Frequency | 500 MHz | — |
| Gehäuse | 1152-BBGA, FC-FBGA (Flip-Chip) | — |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 255000 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| Gehäuse / Bauform | — | 1152-BBGA, FCBGA |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |