EP3SE260F1152I3 vs EP3SE260F1152C2N Comparación
Comparación detallada lado a lado de EP3SE260F1152I3 por Intel y EP3SE260F1152C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1152I3 | EP3SE260F1152C2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16.500,00 | $11.000,00 |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | 10200 |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature grade] |
| Process Technology | 65 nm | 65 nm |
| Maximum Fabric Frequency | 500 MHz | — |
| Encapsulado | 1152-BBGA, FC-FBGA (Flip-Chip) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Family | — | FPGA - Field Programmable Gate Array |
| Number of Logic Elements | — | 255000 |
| Total Memory Bits | — | 16672768 |
| Number of I/O | — | 744 |
| Voltage - Supply | — | 1.1 V |
| Encapsulado / Carcasa | — | 1152-BBGA, FCBGA |
| Maximum Frequency | — | 600 MHz |
| Supplier Device Package | — | 1152-FCBGA |
| Lead Free | — | Yes (per EP3SE260F1152C2G comparison) |
| ECCN | — | [DATA_NEEDED: ECCN code] |
| Moisture Sensitivity | — | [DATA_NEEDED: MSL level] |