EP3SE260F1152I3 vs EP3SE260F1152C3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152I3 von Intel und EP3SE260F1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktivSpezifikationsvergleich
| Parameter | EP3SE260F1152I3 | EP3SE260F1152C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16.500,00 | $7.500,00 |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | 744 |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Betriebstemperatur | -40C to +100C (Industrial) | 0 C to +85 C (Commercial) |
| Process Technology | 65 nm | 65 nm |
| Maximum Fabric Frequency | 500 MHz | — |
| Gehäuse | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |