EP3SE260F1152I3 vs EP3SE260F1152C3N Comparación
Comparación detallada lado a lado de EP3SE260F1152I3 por Intel y EP3SE260F1152C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ ActivoComparación de especificaciones
| Parámetro | EP3SE260F1152I3 | EP3SE260F1152C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16.500,00 | $7.500,00 |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | — |
| Number of LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | 744 |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0 C to +85 C (Commercial) |
| Process Technology | 65 nm | 65 nm |
| Maximum Fabric Frequency | 500 MHz | — |
| Encapsulado | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-BBGA, FCBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |