EP3SE260F1152I3G vs EP3SE260F1152C4N Vergleich
Detaillierter Direktvergleich von EP3SE260F1152I3G von Intel und EP3SE260F1152C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1152I3G | EP3SE260F1152C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.240,00 | $1.620,00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | Stratix III (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | — |
| Gehäuse | 1152-BBGA, FCBGA (FineLine BGA) | 1152-ball FC-FBGA (flip-chip) |
| Betriebstemperaturbereich | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | -4 (commercial temperature) |
| Process Technology | 40 nm TSMC low-power | 65 nm CMOS |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance not stated in scraped data] | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| Betriebstemperatur | — | 0C to +85C (commercial, 'C' suffix) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Speichertyp | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |