EP3SE260F1152I3G vs EP3SE260F1152C4N Comparison
Detailed side-by-side comparison of EP3SE260F1152I3G by Intel and EP3SE260F1152C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1152I3G | EP3SE260F1152C4N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,240.00 | $1,620.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | Stratix III (Enhanced) |
| Logic Elements (LE) | 255,000 | β |
| Embedded Memory Bits | 16,672,640 bits | β |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | β |
| User I/O Count | 744 | β |
| Package | 1152-BBGA, FCBGA (FineLine BGA) | 1152-ball FC-FBGA (flip-chip) |
| Operating Temperature Range | -40C to +100C (Industrial) | β |
| Speed Grade | I3 (Industrial, balanced) | -4 (commercial temperature) |
| Process Technology | 40 nm TSMC low-power | 65 nm CMOS |
| Supply Voltage Core | 0.9 V (typical, see handbook) | β |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | β |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS compliance not stated in scraped data] | β |
| Moisture Sensitivity Level (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | β |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | β |
| Design Toolchain | Quartus II / Quartus Prime | β |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | β |
| Logic Elements (LEs) | β | 255,000 |
| Embedded Memory | β | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | β | 744 |
| Number of LABs/CLBs | β | 10,200 |
| DSP / 18x18 Multipliers | β | 768 embedded multipliers |
| Core Voltage | β | 1.1 V |
| Maximum Operating Frequency | β | 450 MHz |
| Operating Temperature | β | 0C to +85C (commercial, 'C' suffix) |
| Packaging | β | Tray |
| Lead-Free / RoHS | β | Lead-free finish (RoHS compliant per distributor listing) |
| Memory Type | β | SRAM-based, volatile (requires configuration device) |
| Configuration | β | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | β | Obsolete (per Xecor cross-reference data) |