EP3SE260F1517C2G vs EP3SE260F1517C3N Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C2G von Intel und EP3SE260F1517C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260F1517C2G | EP3SE260F1517C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.050,00 | $9.850,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 254,400 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | 16 |
| Gehäuse | 1517-ball FCBGA, 40x40 mm | 1517-BBGA (FCBGA) |
| Speed Grade | C2 (commercial, ~6 ns) | C3 (commercial) |
| Betriebstemperatur | 0C to 85C (commercial, "C" suffix) | — |
| Process Node | 40 nm TSMC | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| Betriebs-Sperrschichttemperatur | — | 0 C to +85 C (commercial) |
| Montageart | — | Surface Mount |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |