EP3SE260F1517C2G vs EP3SE260F1517C3N 对比
详细并排对比 EP3SE260F1517C2G 出自 Intel 和 EP3SE260F1517C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260F1517C2G | EP3SE260F1517C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,050.00 | $9,850.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 254,400 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | — |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | 16 |
| 封装 | 1517-ball FCBGA, 40x40 mm | 1517-BBGA (FCBGA) |
| Speed Grade | C2 (commercial, ~6 ns) | C3 (commercial) |
| 工作温度 | 0C to 85C (commercial, "C" suffix) | — |
| Process Node | 40 nm TSMC | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Process Technology | — | 65 nm TSMC low-power CMOS |
| 工作结温 | — | 0 C to +85 C (commercial) |
| 安装类型 | — | Surface Mount |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |