EP3SE260F1517C3 vs EP3SE260F1517C2G Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C3 von Intel und EP3SE260F1517C2G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C3 | EP3SE260F1517C2G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.800,00 | $2.050,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | 40 nm TSMC |
| Gehäuse | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FCBGA, 40x40 mm |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | C2 (commercial, ~6 ns) |
| Configuration | SRAM-based, requires external configuration device | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Stratix III E |
| Adaptive Logic Modules (ALMs) | — | 81,760 |
| Total Memory Bits | — | 16,727,680 (16.67 Mbit) |
| Embedded Memory (M9K Blocks) | — | 864 |
| Embedded Multipliers (18x18) | — | 768 |
| User I/O Pins | — | 976 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | — | 8 fractional + 4 CMU |
| Global Clock Networks | — | 20 |
| Betriebstemperatur | — | 0C to 85C (commercial, "C" suffix) |
| Lead-Free / Halogen-Free | — | Yes / Yes |