EP3SE260F1517C3 vs EP3SE260F1517C2G Comparación
Comparación detallada lado a lado de EP3SE260F1517C3 por Intel y EP3SE260F1517C2G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3 | EP3SE260F1517C2G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.800,00 | $2.050,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | 40 nm TSMC |
| Encapsulado | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FCBGA, 40x40 mm |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | C2 (commercial, ~6 ns) |
| Configuration | SRAM-based, requires external configuration device | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Family | — | Stratix III E |
| Adaptive Logic Modules (ALMs) | — | 81,760 |
| Total Memory Bits | — | 16,727,680 (16.67 Mbit) |
| Embedded Memory (M9K Blocks) | — | 864 |
| Embedded Multipliers (18x18) | — | 768 |
| User I/O Pins | — | 976 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | — | 8 fractional + 4 CMU |
| Global Clock Networks | — | 20 |
| Temperatura de funcionamiento | — | 0C to 85C (commercial, "C" suffix) |
| Lead-Free / Halogen-Free | — | Yes / Yes |