EP3SE260F1517C3 vs EP3SE260F1517C4 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C3 von Intel und EP3SE260F1517C4 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C3 | EP3SE260F1517C4 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.800,00 | $8.400,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | 40 nm |
| Gehäuse | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | -4 |
| Configuration | SRAM-based, requires external configuration device | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant (per Altera product page) |
| Family | — | Stratix® III E FPGA |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 10,200 LABs / 10200 ALMs (per Mouser listing) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Count | — | 976 |
| DSP Blocks | — | 768 (18x18 multipliers per Mouser listing) |
| Ball Count | — | 1517 |
| Package Style | — | Flip-Chip BGA |
| Betriebstemperatur | — | Commercial (0C to +85C) - inferred from C4 suffix |
| Lead-Free | — | Yes |