EP3SE260F1517C3 vs EP3SE260F1517I3G Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C3 von Intel und EP3SE260F1517I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C3 | EP3SE260F1517I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.800,00 | $3.520,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | 65 nm |
| Gehäuse | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | Industrial (-40C to +100C) |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | — |
| Family | — | Stratix III E |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| User I/O Count | — | 976 |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |