EP3SE260F1517C3 vs EP3SE260F1517I3G Comparación
Comparación detallada lado a lado de EP3SE260F1517C3 por Intel y EP3SE260F1517I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3 | EP3SE260F1517I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.800,00 | $3.520,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | 65 nm |
| Encapsulado | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | Industrial (-40C to +100C) |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | — |
| Family | — | Stratix III E |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| User I/O Count | — | 976 |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |