EP3SE260F1517C3 vs EP3SL340F1517C3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C3 von Intel und EP3SL340F1517C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C3 | EP3SL340F1517C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.800,00 | $0,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III L |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | — |
| Gehäuse | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 337,500 |
| Logic Elements/Cells | — | 337,500 |
| LABs | — | 13,500 |
| User I/O | — | 976 |
| Memory Bits | — | 18,822,144 bits |
| Process Technology | — | 65 nm |
| Maximum Reported Frequency | — | 500 MHz |
| Terminal Count | — | 1517 pins |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |