EP3SE260F1517C3N vs EP3SE260F1517C2 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C3N von Intel und EP3SE260F1517C2 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Letzte BestellmöglichkeitAltera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE260F1517C3N | EP3SE260F1517C2 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9.850,00 | $15.800,00 |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | 12 |
| Global Clock Networks | 16 | — |
| Gehäuse | 1517-BBGA (FCBGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | C2 |
| Betriebs-Sperrschichttemperatur | 0 C to +85 C (commercial) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance] |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 254,400 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Total Memory Bits | — | 16,672,768 |
| Distributed RAM (Kb) | — | 4,608 |
| Embedded Block RAM (Kb) | — | 15,408 |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Pins | — | 976 |
| High-Speed Transceivers | — | 48 (up to 6.375 Gbps) |
| Temperature Grade | — | Commercial (0C to +85C, suffix C2) |
| Process Node | — | TSMC 40 nm |