EP3SE260F1517C3N vs EP3SE260F1517C2 Comparación
Comparación detallada lado a lado de EP3SE260F1517C3N por Intel y EP3SE260F1517C2 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260F1517C3N | EP3SE260F1517C2 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9.850,00 | $15.800,00 |
| Family | Stratix III E | — |
| Logic Elements | 254,400 | — |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | 12 |
| Global Clock Networks | 16 | — |
| Encapsulado | 1517-BBGA (FCBGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | C2 |
| Temperatura de unión de funcionamiento | 0 C to +85 C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 254,400 |
| Logic Array Blocks (LAB) | — | 10,200 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Total Memory Bits | — | 16,672,768 |
| Distributed RAM (Kb) | — | 4,608 |
| Embedded Block RAM (Kb) | — | 15,408 |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Pins | — | 976 |
| High-Speed Transceivers | — | 48 (up to 6.375 Gbps) |
| Temperature Grade | — | Commercial (0C to +85C, suffix C2) |
| Process Node | — | TSMC 40 nm |