EP3SE260F1517C4N vs EP3SE260F1517I3 Vergleich
Detaillierter Direktvergleich von EP3SE260F1517C4N von Intel und EP3SE260F1517I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260F1517C4N | EP3SE260F1517I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.800,00 | $10.500,00 |
| Series | Stratix® III E | — |
| Family | Field-Programmable Gate Array (FPGA) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | 976 |
| Gehäuse | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0°C to 85°C | — |
| Core Voltage | 0.9 V | 1.0 V typical |
| Process Node | 65 nm | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Embedded Memory (bits) | — | 16,672,768 |
| Operating Temperature Grade | — | Industrial |
| Junction Temperature Range | — | -40C to +125C |
| Process Technology | — | 65 nm CMOS |
| Maximum Core Frequency | — | 717 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Configuration | — | SRAM-based, volatile (requires external configuration device) |