EP3SE260H780C4 vs EP3SE260F1152C4 Vergleich
Detaillierter Direktvergleich von EP3SE260H780C4 von Intel und EP3SE260F1152C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
EP3SE260H780C4 Obsolete
Spezifikationsvergleich
| Parameter | EP3SE260H780C4 | EP3SE260F1152C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.150,00 | $8.900,00 |
| Family | Stratix III E | Stratix III |
| Logic Elements | 255,000 | — |
| Total Memory Bits | 16,672,640 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/Os | 488 | — |
| Embedded Multipliers (18x18) | 576 | — |
| Distributed Memory | 1,020 Kbits | — |
| Number of PLLs | 8 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Auxiliary Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS (TSMC) |
| Speed Grade | C4 | C4 (slowest commercial grade) |
| Gehäuse | 780-ball FCBGA (H780) | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant (per distributor listings) |
| Series | — | Stratix III E (Enhanced) |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 |
| User I/O Count | — | 744 |
| Maximum Internal Frequency | — | ~450 MHz (per FPGAkey listing) |
| Package Code | — | BGA, square |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |
| DSP Blocks (18x18 Multipliers) | — | 384 |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Transceivers | — | External PHY interface only (no integrated GXB) |
| Betriebstemperatur | — | Commercial (0C to +85C) - inferred from speed grade C4 |