EP3SE260H780C4L vs EP3SE260H780I4 Vergleich
Detaillierter Direktvergleich von EP3SE260H780C4L von Intel und EP3SE260H780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260H780C4L | EP3SE260H780I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.190,00 | $1.390,00 |
| Family | Stratix III E | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 (16.7 Mbit) | — |
| User I/O Count | 488 | — |
| Gehäuse | 780-ball FCBGA (HBGA 33x33 mm) | 780-ball FC-HFBGA (HBGA) |
| Speed Grade | C4 (middle/slow tier) | 4 |
| Core Voltage | 0.9 V (nominal) | 1.1 V |
| Betriebs-Sperrschichttemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant (lead-free per datasheet) | [DATA_NEEDED: RoHS compliance status] |
| Transceivers | Up to 24 multi-gigabit transceivers | — |
| Memory Interface | DDR3, DDR2, QDRII+, RLDRAM II controllers | — |
| Configuration Mode | PS, FPP, JTAG with EPCS/EPCQ | — |
| Logic Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Betriebstemperatur | — | -40C to +100C (industrial, 'I' grade) |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |