EP3SE260H780C4LN vs EP3SE260H780I4L Vergleich

Detaillierter Direktvergleich von EP3SE260H780C4LN von Intel und EP3SE260H780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE260H780C4LN EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel

EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel

EP3SE260H780C4LN ⚠ Letzte Bestellmöglichkeit
Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE260H780C4LN EP3SE260H780I4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $11.950,00 $1.395,00
Family Stratix III E Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Logic Array Blocks (LABs) 10,200 —
Embedded Multipliers (18x18) 384 —
User I/O Count 488 488
Gehäuse 780-ball FCBGA (FineLine BGA) —
Speed Grade C4 (commercial, moderate speed) —
Betriebstemperatur 0C to +85C (commercial) Industrial, -40C to +85C
Core Voltage (VCC) 1.0 V —
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) —
Auxiliary Voltage (VCCPD/VCCPT) 2.5 V / 3.0 V —
PLLs 8 —
Global Clock Networks 16 —
Process Node 40 nm TSMC —
Configuration Modes FPP, AS, PS, JTAG —
RoHS-Status Compliant Compliant (lead-free)
MSL-Level 3 (168 hours) —
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
Core Voltage — 0.9 V
Process Technology — 65 nm
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Montageart — Surface Mount (flip-chip)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern