EP3SE260H780C4LN vs EP3SE260H780I4L 비교
다음의 상세 나란히 비교: EP3SE260H780C4LN 제조: Intel 및 EP3SE260H780I4L 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3SE260H780C4LN | EP3SE260H780I4L |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $11,950.00 | $1,395.00 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/O Count | 488 | 488 |
| 패키지 | 780-ball FCBGA (FineLine BGA) | — |
| Speed Grade | C4 (commercial, moderate speed) | — |
| 동작 온도 | 0C to +85C (commercial) | Industrial, -40C to +85C |
| Core Voltage (VCC) | 1.0 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Auxiliary Voltage (VCCPD/VCCPT) | 2.5 V / 3.0 V | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Process Node | 40 nm TSMC | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| RoHS 상태 | Compliant | Compliant (lead-free) |
| MSL 레벨 | 3 (168 hours) | — |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 65 nm |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| 실장 유형 | — | Surface Mount (flip-chip) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |