EP3SE260H780C4N vs EP3SE260H780C3N Vergleich

Detaillierter Direktvergleich von EP3SE260H780C4N von Intel und EP3SE260H780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE260H780C4N EP3SE260H780C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.325,00
Family Stratix III E (Enhanced) —
Logic Elements 255,000 —
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 —
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS —
Core Voltage 0.86 V to 1.15 V —
Maximum Core Clock Frequency 450 MHz —
Gehäuse 780-ball FCBGA (Flip Chip BGA) 780-BBGA, FCBGA (H780)
Montageart Surface Mount Surface Mount
Feuchtigkeitsempfindlichkeitsgrad (MSL) 3 (168 hours) [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Betriebstemperatur 0C to +85C (commercial) 0 °C to +85 °C (C grade, commercial)
Configuration Method Serial/Parallel via Quartus II SRAM-based, configured via JTAG / passive / active serial / fast passive parallel
Series — Stratix® III E
Logic Elements (LE) — 255,000
Embedded Memory (bits) — 16,672,768
Number of LABs/CLBs — 10,200
User I/Os — 488
Number of Pins / Balls — 780
Process Technology — 40 nm CMOS
Maximum Core Frequency — [DATA_NEEDED: maximum core frequency MHz]
Supply Voltage (VCCINT) — [DATA_NEEDED: VCCINT nominal V]
Transceivers — [DATA_NEEDED: number of embedded transceivers and max data rate]
DSP Blocks — [DATA_NEEDED: number of DSP blocks and precision]
RoHS-Status — Compliant (lead-free 'N' suffix)
Design Toolchain — Altera Quartus II (legacy); Intel Quartus Prime

Datenblätter & Ressourcen

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