EP3SE260H780I4L vs EP3SL50F780I4L Vergleich

Detaillierter Direktvergleich von EP3SE260H780I4L von Intel und EP3SL50F780I4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP3SE260H780I4L EP3SL50F780I4L
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $695,09
Family Stratix III E (Enhanced) Stratix III L
Logic Elements 255,000 47,500
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 488
Core Voltage 0.9 V 0.9 V
Process Technology 65 nm 65 nm CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Montageart Surface Mount (flip-chip) Surface Mount (BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Betriebstemperatur Industrial, -40C to +85C -40C to +100C (Industrial)
RoHS-Status Compliant (lead-free) —
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Embedded Memory (bits) — 2,184,192
I/O Banks — 8
Gehäuse — 780-BBGA, FCBGA (29 mm)
Lead-Free / RoHS — Yes (L suffix)
Speed Grade — I4
MSL-Level — [DATA_NEEDED: MSL moisture sensitivity level]
Configuration Memory — SRAM-based, volatile
Design Suite — Quartus II / Quartus Prime (Stratix III support)
Device Sub-Family — Low-Power (L)
Country of Origin — [DATA_NEEDED: COO not specified in source data]

Datenblätter & Ressourcen

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