EP3SE260H780I4LG vs EP3SE260H780C4L Vergleich
Detaillierter Direktvergleich von EP3SE260H780I4LG von Intel und EP3SE260H780C4L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE260H780I4LG | EP3SE260H780C4L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.580,00 | $1.190,00 |
| Series | Stratix III Enhanced | — |
| Family | EP3SE260 | Stratix III E |
| Logic Elements | 255,000 LE | 255,000 |
| Adaptive Logic Modules (ALMs) | 102,000 ALM | — |
| Embedded Memory | 15.90 Mbit | — |
| DSP Blocks | 304 | — |
| 18x18 Multipliers | 840 | — |
| User I/O | 488 | — |
| PLLs | 8 (4 fractional + 4 general-purpose) | — |
| Speed Grade | -4 | C4 (middle/slow tier) |
| Temperature Grade | Industrial (I) | — |
| Gehäuse | 780-ball FineLine BGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Betriebstemperatur | -40C to +100C | — |
| Process Technology | 65 nm low-power CMOS | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V (nominal) |
| Betriebs-Sperrschichttemperatur | — | 0C to +85C (commercial) |
| Montageart | — | Surface Mount (flip-chip BGA) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| RoHS-Status | — | Compliant (lead-free per datasheet) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |