EP3SE260H780I4LG vs EP3SE260H780C4L Comparación
Comparación detallada lado a lado de EP3SE260H780I4LG por Intel y EP3SE260H780C4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260H780I4LG | EP3SE260H780C4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.580,00 | $1.190,00 |
| Series | Stratix III Enhanced | — |
| Family | EP3SE260 | Stratix III E |
| Logic Elements | 255,000 LE | 255,000 |
| Adaptive Logic Modules (ALMs) | 102,000 ALM | — |
| Embedded Memory | 15.90 Mbit | — |
| DSP Blocks | 304 | — |
| 18x18 Multipliers | 840 | — |
| User I/O | 488 | — |
| PLLs | 8 (4 fractional + 4 general-purpose) | — |
| Speed Grade | -4 | C4 (middle/slow tier) |
| Temperature Grade | Industrial (I) | — |
| Encapsulado | 780-ball FineLine BGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| Temperatura de funcionamiento | -40C to +100C | — |
| Process Technology | 65 nm low-power CMOS | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V (nominal) |
| Temperatura de unión de funcionamiento | — | 0C to +85C (commercial) |
| Tipo de montaje | — | Surface Mount (flip-chip BGA) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Estado RoHS | — | Compliant (lead-free per datasheet) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |