EP3SE50F484C3G vs EP3SE50F484C2G Vergleich
Detaillierter Direktvergleich von EP3SE50F484C3G von Intel und EP3SE50F484C2G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel
EP3SE50F484C2G ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP3SE50F484C3G | EP3SE50F484C2G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $205,00 | $1.180,00 |
| Family | Stratix III E | — |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Gehäuse | 484-ball FCBGA (F484), 1.0 mm pitch | — |
| Speed Grade | C3 | — |
| Betriebstemperatur | 0C to +85C (commercial, "C") | 0 °C to +85 °C (TJ) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Series | — | Stratix III E |
| Number of Logic Elements / Cells | — | 47,500 |
| Number of LABs / CLBs | — | 1,900 |
| Total RAM Bits | — | 5,760,000 (5,760 Kbit) |
| Number of User I/O | — | 296 |
| Gehäuse / Bauform | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | — | 0.86 V to 1.15 V |
| Process Technology | — | 40 nm TSMC low-power CMOS |
| Logic Element Architecture | — | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | — | Yes (variable-precision multipliers) |
| Transceivers | — | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | — | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | — | Supported |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | — | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |