EP3SE50F484C3G vs EP3SE50F484C2G 对比
详细并排对比 EP3SE50F484C3G 出自 Intel 和 EP3SE50F484C2G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F484C3G | EP3SE50F484C2G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $205.00 | $1,180.00 |
| Family | Stratix III E | — |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | — |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| 封装 | 484-ball FCBGA (F484), 1.0 mm pitch | — |
| Speed Grade | C3 | — |
| 工作温度 | 0C to +85C (commercial, "C") | 0 °C to +85 °C (TJ) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant (lead-free) | Compliant |
| Series | — | Stratix III E |
| Number of Logic Elements / Cells | — | 47,500 |
| Number of LABs / CLBs | — | 1,900 |
| Total RAM Bits | — | 5,760,000 (5,760 Kbit) |
| Number of User I/O | — | 296 |
| 封装 / 外壳 | — | 484-BBGA, FCBGA (FineLine BGA) |
| Core Voltage Supply | — | 0.86 V to 1.15 V |
| Process Technology | — | 40 nm TSMC low-power CMOS |
| Logic Element Architecture | — | Adaptive Logic Module (ALM) with 8-input fracturable LUT |
| Embedded DSP Blocks | — | Yes (variable-precision multipliers) |
| Transceivers | — | Multi-gigabit transceivers (selected package pins) |
| Memory Interface Support | — | DDR / DDR2 / DDR3 with hard PHY |
| Partial Reconfiguration | — | Supported |
| Configuration Interface | — | JTAG, Passive Serial, Fast Passive Parallel |
| Part Status | — | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy |