EP3SE50F484I3N vs EP3SE50F484I4G Vergleich
Detaillierter Direktvergleich von EP3SE50F484I3N von Intel und EP3SE50F484I4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F484I3N | EP3SE50F484I4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $841,66 | $285,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | 47,500 LE |
| Number of LABs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| Maximum User I/O | 296 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage VCC | 0.9 V | — |
| Auxiliary Voltage VCCAUX | 1.1 V | — |
| Process Technology | 65 nm | 40 nm low-power CMOS |
| Maximum Internal Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial, bin 3) | 4 |
| Betriebstemperatur | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Gehäuse | 484-pin FC-FBGA (flip-chip BGA) | 484-Ball FCBGA (FineLine BGA) |
| Montageart | Surface Mount (BGA) | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Configuration Method | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) | — |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: number of 18x18 multipliers] | — |
| Transceiver Count | [DATA_NEEDED: number of embedded transceivers] | Up to 12 (Stratix III E family) |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.49 Mbit |
| User I/Os | — | 296 I/O |
| Betriebsversorgungsspannung | — | 1.1 V (core) |
| Montagestil | — | SMD/SMT |
| RoHS-Status | — | Compliant (lead-free 'G' suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |
| External Memory Support | — | DDR3, DDR2, QDR II/II+ |