EP3SE50F484I4 vs EP3SE50F484I3N Vergleich
Detaillierter Direktvergleich von EP3SE50F484I4 von Intel und EP3SE50F484I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3SE50F484I4 | EP3SE50F484I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $730,00 | $841,66 |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LAB) | 1,900 | — |
| Maximum User I/O | 296 | 296 |
| Embedded Memory (Bits) | 5,760,000 | — |
| DSP Blocks (18x18 Multipliers) | 216 | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Gehäuse | 484-ball FC-FBGA | 484-pin FC-FBGA (flip-chip BGA) |
| Package Code | BBGA / FC-FBGA | — |
| Temperature / Speed Grade | I4 (Industrial) | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 47,500 |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| Speed Grade | — | I3 (industrial, bin 3) |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |