EP3SE50F780C2 vs EP3SE50F780C4N Vergleich

Detaillierter Direktvergleich von EP3SE50F780C2 von Intel und EP3SE50F780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F780C2 EP3SE50F780C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.195,00 $1.430,00
Family Stratix III E Stratix III E
Manufacturer Intel (formerly Altera) —
Logic Elements (LE) 47,500 47,500
LABs / CLBs 1,900 —
Total Memory Bits 5,760,000 —
User I/O Count 488 —
DSP Blocks (18x18 multipliers) 384 432
Core Voltage 1.1 V —
Process Technology 65 nm —
Operating Frequency Up to 600 MHz —
Gehäuse 780-BBGA, FC-FBGA 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status [DATA_NEEDED: current RoHS status] Lead-free / RoHS compliant
Number of Pins / Terminals 780 —
Form of Terminal Ball —
Package Code BGA —
Operating Temperature Grade Commercial (C2) —
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
PLLs — 12 (per family datasheet)
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Process Node — 40 nm
Versorgungsspannung — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Betriebstemperatur — 0C to +85C (C4 commercial grade)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
MSL-Level — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

Datenblätter & Ressourcen

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