EP3SE50F780C2 vs EP3SE50F780C4N 对比
详细并排对比 EP3SE50F780C2 出自 Intel 和 EP3SE50F780C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F780C2 | EP3SE50F780C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,195.00 | $1,430.00 |
| Family | Stratix III E | Stratix III E |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 47,500 | 47,500 |
| LABs / CLBs | 1,900 | — |
| Total Memory Bits | 5,760,000 | — |
| User I/O Count | 488 | — |
| DSP Blocks (18x18 multipliers) | 384 | 432 |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Operating Frequency | Up to 600 MHz | — |
| 封装 | 780-BBGA, FC-FBGA | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: current RoHS status] | Lead-free / RoHS compliant |
| Number of Pins / Terminals | 780 | — |
| Form of Terminal | Ball | — |
| Package Code | BGA | — |
| Operating Temperature Grade | Commercial (C2) | — |
| Embedded Memory Bits | — | 5,760,000 |
| Embedded Memory (M9K/M144K blocks) | — | 488 (per family datasheet) |
| Number of LABs | — | 1900 |
| Maximum User I/Os | — | 488 |
| PLLs | — | 12 (per family datasheet) |
| Maximum Operating Frequency | — | 717 MHz |
| Transceiver Channels | — | Up to 12 (per family, model-dependent) |
| Transceiver Data Rate | — | Up to 6.375 Gbps (per Stratix III E family) |
| Process Node | — | 40 nm |
| 电源电压 | — | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) |
| 工作温度 | — | 0C to +85C (C4 commercial grade) |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel |
| MSL 等级 | — | 3 (per JEDEC J-STD-020, FBGA package) |
| Hard Memory Controller | — | DDR2/DDR3 SDRAM (per Stratix III E family) |