EP3SE50F780C4L vs EP3SE50F780C4N Vergleich

Detaillierter Direktvergleich von EP3SE50F780C4L von Intel und EP3SE50F780C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F780C4L EP3SE50F780C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.320,00 $1.430,00
Series Stratix III E —
Family Stratix III Stratix III E
Logic Elements (LE) 47,500 47,500
Embedded Memory 5,760,000 bits —
User I/Os 488 —
DSP Blocks (18x18 multipliers) 304 (19x16) 432
Gehäuse 780-ball FCBGA (Flip-Chip BGA) 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch
Process Node 40 nm 40 nm
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) —
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
Betriebstemperatur [DATA_NEEDED: full industrial/commercial grade] 0C to +85C (C4 commercial grade)
RoHS-Status Compliant (lead-free) Lead-free / RoHS compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] —
PLLs [DATA_NEEDED: PLL count] 12 (per family datasheet)
Embedded Memory Bits — 5,760,000
Embedded Memory (M9K/M144K blocks) — 488 (per family datasheet)
Number of LABs — 1900
Maximum User I/Os — 488
Maximum Operating Frequency — 717 MHz
Transceiver Channels — Up to 12 (per family, model-dependent)
Transceiver Data Rate — Up to 6.375 Gbps (per Stratix III E family)
Montageart — Surface Mount (BGA)
Versorgungsspannung — Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail)
Configuration Modes — JTAG, Passive Serial, Fast Passive Parallel
MSL-Level — 3 (per JEDEC J-STD-020, FBGA package)
Hard Memory Controller — DDR2/DDR3 SDRAM (per Stratix III E family)

Datenblätter & Ressourcen

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