EP3SE50F780C4N vs EP3SE50F780C2 Vergleich

Detaillierter Direktvergleich von EP3SE50F780C4N von Intel und EP3SE50F780C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3SE50F780C4N EP3SE50F780C2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.430,00 $1.195,00
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 47,500
Embedded Memory Bits 5,760,000 —
Embedded Memory (M9K/M144K blocks) 488 (per family datasheet) —
Number of LABs 1900 —
Maximum User I/Os 488 —
DSP Blocks (18x18 multipliers) 432 384
PLLs 12 (per family datasheet) —
Maximum Operating Frequency 717 MHz —
Transceiver Channels Up to 12 (per family, model-dependent) —
Transceiver Data Rate Up to 6.375 Gbps (per Stratix III E family) —
Process Node 40 nm —
Gehäuse 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch 780-BBGA, FC-FBGA
Montageart Surface Mount (BGA) Surface Mount
Versorgungsspannung Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) —
Betriebstemperatur 0C to +85C (C4 commercial grade) —
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel —
RoHS-Status Lead-free / RoHS compliant [DATA_NEEDED: current RoHS status]
MSL-Level 3 (per JEDEC J-STD-020, FBGA package) —
Hard Memory Controller DDR2/DDR3 SDRAM (per Stratix III E family) —
Manufacturer — Intel (formerly Altera)
LABs / CLBs — 1,900
Total Memory Bits — 5,760,000
User I/O Count — 488
Core Voltage — 1.1 V
Process Technology — 65 nm
Operating Frequency — Up to 600 MHz
Number of Pins / Terminals — 780
Form of Terminal — Ball
Package Code — BGA
Operating Temperature Grade — Commercial (C2)

Datenblätter & Ressourcen

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