EP3SE50F780C4N vs EP3SE50F780C4G Vergleich
Detaillierter Direktvergleich von EP3SE50F780C4N von Intel und EP3SE50F780C4G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SE50F780C4G - Stratix III E FPGA, 47.5K LE, 488 I/O, 780-FBGA | Intel
EP3SE50F780C4G ✓ AktivSpezifikationsvergleich
| Parameter | EP3SE50F780C4N | EP3SE50F780C4G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.430,00 | $593,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 47,500 | — |
| Embedded Memory Bits | 5,760,000 | — |
| Embedded Memory (M9K/M144K blocks) | 488 (per family datasheet) | — |
| Number of LABs | 1900 | — |
| Maximum User I/Os | 488 | — |
| DSP Blocks (18x18 multipliers) | 432 | — |
| PLLs | 12 (per family datasheet) | — |
| Maximum Operating Frequency | 717 MHz | — |
| Transceiver Channels | Up to 12 (per family, model-dependent) | — |
| Transceiver Data Rate | Up to 6.375 Gbps (per Stratix III E family) | — |
| Process Node | 40 nm | — |
| Gehäuse | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (FCBGA) |
| Montageart | Surface Mount (BGA) | Surface Mount (SMD/SMT) |
| Versorgungsspannung | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) | — |
| Betriebstemperatur | 0C to +85C (C4 commercial grade) | — |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel | — |
| RoHS-Status | Lead-free / RoHS compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020, FBGA package) | MSL3 (per JEDEC J-STD-020) |
| Hard Memory Controller | DDR2/DDR3 SDRAM (per Stratix III E family) | — |
| Series | — | Stratix III |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 5.76 Mbit (5760000 bit) |
| Number of I/Os | — | 488 |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count from datasheet] |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Process Technology | — | 40 nm TSMC |
| Core Supply Voltage | — | 1.1 V |
| Betriebstemperaturbereich | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |
| Design Software | — | Quartus II |